Development of technology for the formation of lead-free final coating of printed circuit boards for instrument making means

Development of technology for the formation of lead-free final coating of printed circuit boards for instrument making means

Activity Start Date 04.03.2016
Advantages and Innovations: Advantages of the offered technology are as follows: - Coating composition does not include lead components; - the technology differs from the currently used at environmental risk, since it does not use toxic and hard recyclable additives; - High strength adhesion of the coating with the surface; - Low contact resistance, good solderability; - Increased corrosion resistance of printed circuit boards during operation.
Center name: ПТПП
Center site: www.tpppnz.ru
Copyright: Patent(s) applied for but not yet granted
Date of creation: 04.03.2016
Description of the offer: Traditionally, as a final coating of printed circuit boards are used lead-tin alloy, applied by solution dip or electroplated methods. A disadvantage of this coating is the presence of the highly toxic lead in the coating composition as well as in a melt for coating. The Penza University (Russia), Department of "Chemistry" offers a technology developed by the formation of lead-free topcoat for printed circuit boards to use in production of instrument-making industry. The proposed technology - formation of lead-free coatings instead of coating tin-lead alloy has the properties of providing the requirements of GOST 23752-79 "Printed boards. General specifications ". Replacing coating allows to remove lead from the coating material, as well as from technological operations of application of these coatings. The developed coating has a high adhesive strength to the surface, low electrical resistance, good solderability. These properties of the coating are preserved articles during operation, i.e. have high corrosion resistance. Qualitative characteristics of the print on the proposed technology does not deteriorate in comparison with the seal coated with tin-lead, only reduce environmental risks, as well as improves the corrosion resistance of materials and equipment. Using similar coatings, which include lead, causing great environmental damage and harm to the health of enterprises employees working on the machines. This development reduces the environmental risks and ensures safety of employees. Within the framework of technical cooperation the University of Penza expects conduct industrial trials with potential partners and the refinement of the proposed technology, as well as its subsequent implementation.
Market Keywords: 07005004 Education and educational products and materials
Profile type: Technology offer
Restrict Dissemination to specific countries: CIS Countries / Armenia / Belarus / Moldova / Ukraine / EEN Countries / Austria / Belgium / Bosnia and Herzegovina / Bulgaria / Chile / China / Egypt / Iceland / Israel / Japan / Macedonia, The former Yugoslav Republic of / Mexico / Montenegro / Norway / South Korea / Switzerland / Syria / Tunisia / Turkey / USA / Albania / Argentina / Brazil / Canada / Georgia / India / Country_Indonesia / Jordan / New Zealand / Paraguay / Peru / Russian Federation / Serbia / Singapore / Taiwan / EU Countries / Croatia / Cyprus / Czech Republic / Denmark / Estonia / Finland / France / Germany / Greece / Hungary / Ireland / Italy / Latvia / Lithuania / Luxembourg / Malta / Netherlands / Poland / Portugal / Romania / Slovakia / Slovenia / Spain / Sweden / United Kingdom
Summary: The Russian university (from Penza)has developed a technology for forming a lead-free topcoat of printed circuit boards for instrument-making means to provide solderability and corrosion protection. The technology reduces the environmental hazard, ensure compliance with the requirements of European Union directives on environmental safety. The authors are looking for partners (instrument-making enterprises) for industrial testing and implementation in the framework of technical cooperation.
Technological Keywords: 11002 Education and Training
Type and Role of Partner Sought: Type: industrial enterprises Sphere of activity: manufacturing of instrument making means, electronics Role: interest in industrial testing, development of the technology, in a future - to implement the technology
Type of Partnership Required: Technical cooperation agreement

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